Nano-Scale Process Control: Driving Yield to the Limit

High-end SPC for Wafer Fabrication & OSAT. Solving challenges in non-normal distribution fitting, Multi-Head consistency, and real-time monitoring of massive ATE data streams.

auto_graphNon-Normal Fitting hubMulti-Head Consistency speedATE Real-Time Data Stream biotechYield Correlation Mining
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Industry Pain Points

"A 0.1% Yield drop means millions in losses. Can your SPC software catch that extremely minute variation?"
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'False Alarms' Caused by Non-Normal Distribution

Process parameters like Etching Depth, Film Thickness, and Flatness often show Skewed distributions. Traditional SPC forces normal distribution formulas for CPK, causing massive False Alarms. Engineers are exhausted chasing ghosts.

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The Multi-Head Consistency 'Nightmare' in Packaging Equipment

Die Bonders and Wire Bonders often have multiple nozzles or bond heads. A common scenario: 'Overall Machine CPK is fine, but one head is producing scrap.' Traditional charts fail to spot local anomalies.

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ATE Test Data Flood

Automatic Test Equipment (ATE) generates thousands of results per second. Manual export and analysis lag behind, failing to intercept ongoing batch failures.

NEXSPC Core Scenarios & Solutions

Bring the semiconductor's 'true distribution, true consistency, and true timeliness' back into statistical models and the engineering closed-loop.

Distribution Fitting Precise Ppk Calculation for Non-Normal Distributions

Precise Ppk Calculation for Non-Normal Distributions

Statistical Accuracy

Reveal the true face of data; reject mathematical model misjudgments. NEXSPC includes an advanced statistical toolbox specifically for the non-normal data prevalent in semiconductor processes.

  • Auto-Fitting：Automatically runs Anderson-Darling tests to match the best-fit curve among Weibull, Log-Normal, Exponential, and other models.
  • Box-Cox Transformation：For extremely complex distributions, one-click Box-Cox transformation converts data to normal before standardized scoring.
  • Accurate Ppk：Calculates Ppk based on the best-fit model, ensuring realistic yield assessment and reducing False Alarms.
Value: Get trustworthy process performance indices even when distribution is non-normal. Make 'Alarms' engineered for meaning.
Head-to-Head Multi-Head/Nozzle Consistency 'Radar' Head 7 error

Multi-Head/Nozzle Consistency 'Radar'

Head-to-Head

Monitor every gold wire; miss no 'weak link' bond head. For multi-channel equipment like Wire Bonders and Die Attachers, NEXSPC offers multi-dimensional group control charts and comparative analysis.

  • Head-to-Head Comparison：Overlay multiple heads/nozzles of the same machine. Instantly identify mean drift and variance anomalies via Group Box Plots.
  • Analysis of Variance (ANOVA)：Automatically determines if differences between heads are significant, guiding Equipment Engineers (EE) on targeted calibration.
Value: Avoid hidden losses where 'Machine is OK but parts are scrap'. Intercept bad head issues before mass defect spread.
WEB API / MQTT / WebSocket / OPC UA 100+ Points/Sec Concurrent Writes

Sub-Second ATE Data Real-Time Interconnection

WEB API / MQTT / WebSocket / OPC UA

Keep pace with the tester's beat; achieve 'Analyze as Tested'. Facing massive data throughput in OSATs, NEXSPC adopts lightweight industrial protocols and high-concurrency write architecture.

  • TCP Listening：For legacy equipment, supports listening to TCP Server ports to parse test logs in real-time.
  • High-Frequency MQTT：Subscribes to tester topics. Supports 100+ points/sec concurrent writes. Generates real-time yield trend charts.
  • Anomaly Interception：Detects N consecutive chip voltage anomalies. Triggers sub-second alarms and linked machine stops.
Value: Upgrade from 'post-mortem check' to real-time health check and interception. Stop batch failures the moment they start.
Regression / Auto-Lag Mining Correlation Between Process Parameters & Yield

Mining Correlation Between Process Parameters & Yield

Data Correlation & Root Cause Analysis

Trace effect to cause; find Key Control Characteristics (KCC). Yield dropped: was it temperature or pressure? NEXSPC links front-end process parameters to Final Test yield in a single 'data causality chain'.

  • Correlation Analysis：Performs regression analysis between Final Test Yield (Y) and front-end equipment parameters (X, e.g., oven temp, pressure).
  • Auto-Lag Mining：Auto-Lag algorithm discovers that 'temperature fluctuation 2 hours ago' is the culprit for 'yield drop now'.
Value: Turn 'guessing' into 'evidence-driven' optimization. Reduce ineffective tuning and improve improvement hit rates.

Customer Value Comparison (Before & After)

From distribution models to data timeliness and analysis depth: every item directly impacts yield and cost.

Dimension Traditional Excel / Generic SPC NEXSPC Semiconductor Edition
Distribution Model Defaults to Normal Distribution. CPK calculation error for non-normal data. Auto-fits Weibull/Log-Normal. Ppk error <1%. <1%
Multi-Head Management Only sees overall equipment capability, masking bad head issues. One-click Group Comparison & Box Plot for Multi-Head/Nozzle. Pinpoint weak Heads.
Data Timeliness Export ATE reports daily/per shift. Only 'Post-Mortem Checks'. MQTT Sub-second Collection. Real-time 'Health Check' & Interception.
Analysis Depth Limited to plotting charts. Offers Six Sigma tools: ANOVA, Regression, Auto-Lag.

Next Industry: Semi & IC Test