Sub-Second Interconnection: Keep Pace with SMT High-Speed Lines

Reject 'post-mortem inspection'. Deeply integrate SPI, Pick & Place, and AOI via MQTT, TCP, WebSocket, OPC UA, and Web API. Intercept even 1 PPM defects before the PCB flows to the next process.

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Industry Pain Points

"When the Pick & Place machine hits 40,000 CPH, can traditional SPC still keep up?"

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Fast Equipment, Slow SPC

SMT lines are fully automated, yet quality data is often manually exported to Excel daily. This post-mortem analysis means that by the time a shift is detected, thousands of PCBs are already scrapped.

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Massive Data Triggering 'Alarm Fatigue'

AOI is extremely sensitive; slight lighting changes cause false calls. Traditional SPC triggers thousands of alarms. Engineers eventually turn off the alarms, missing true defects.

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Non-Normal Solder Paste Thickness

Solder paste thickness and volume measured by SPI often show skewed distributions. Forcing normal distribution CPK calculations results in severely distorted yield predictions.

NEXSPC Core Scenarios & Solutions

Link 'high-speed data throughput, intelligent anomaly detection, PPM operations, and non-normal capability' into an actionable online process control closed-loop.

Connect Everything: Building a 'Real-Time' Factory

Connect Everything

Make SPC the 'nerve center' of the production line. Facing the reality of mixed SMT brands and diverse interfaces, NEXSPC uses lightweight IoT protocols for high-throughput data ingestion.

TCP Port Listening：For legacy Wave Soldering and Reflow Ovens, directly listens to serial/network streams to capture temperature profiles.
MQTT High-Frequency Subscription：Supports concurrent writing of 100+ data points per second. Data stored as generated.

Value: Achieve true process control. Intercept defects BEFORE Reflow for the lowest repair cost.

High-Frequency Data Smart Sampling

Tame massive data streams. Calm the control chart to show only key trends.

Facing the millisecond-level data bombardment from automation (PLC/Sensors), plotting everything makes charts unreadable. NEXSPC offers time-window aggregation strategies to turn 'Data Flow' into 'Information Flow'.

Custom Sampling Window：Supports automatic slicing by N minutes or N hours (e.g., sample once every 10 minutes).
Flexible Aggregation Algorithm：Automatically extracts Mean, Max, or Min within the time window to plot on the control chart.
Application Scenarios：For Temp Control, a 10-min Mean represents steady state better; for Peak Pressure, Max value captures risk better.

Value: Lower observation frequency, higher monitoring quality. Retains 24/7 real-time monitoring while filtering high-frequency noise. Helps engineers judge macro trends clearly and avoid 'Data Overload'.

Non-Normal Optimization for Solder Paste Printing

Box-Cox Transformation

For SPI-detected solder paste volume/thickness data, NEXSPC offers auto-distribution identification, transformation suggestions, and parameter correlation analysis to uncover true process capability.

Auto-Distribution Fitting：Identifies normality. If skewed, automatically recommends Johnson or Box-Cox transformation to calculate a more realistic Ppk.
Parameter Correlation：Run regression analysis between Paste Thickness vs. Squeegee Pressure & Separation Speed to find optimal process factors.

Value: Correct 'misjudged capability indices' into 'actionable process improvements'.

Customer Value Comparison (Before & After)

The gap between offline 'post-mortem analysis' and online 'real-time interception' is directly reflected in scrap and rework costs.

Dimension	Traditional Mode (Offline SPC)	NEXSPC Electronics Edition (Online IoT)
Data Acquisition	Manual daily log export, or even handwritten transcription.	MQTT second-level auto-collection. Unmanned operation.
Alarm Response	By the time issues are found, the warehouse is full of defectives.	Custom anomalies trigger instant machine stop. Nip it in the bud.
Traceability Granularity	Traceable only to Batch level.	Traceable to every PCB's Barcode (SN).